V3 Compact Batch Immersion System

System Overview
V3 Compact Batch Immersion System offering either dry-to-dry or dry-to-wet processing with low exhaust requirements, few facility connections and easy maintenance access, while maintaining as much as a 20 percent footprint reduction over comparable tool sets. The V3 robot is designed to accommodate 150 mm or 200 mm wafers in standard cassettes for IC devices; alternate cassettes allow other materials to be processed using the standard robot arm. Suitable for R&D labs and applications.

 V3 Compact Batch Immersion System

V3 Compact Batch Immersion System

Substrate Size:
Applications compounds:
Technology Markets:

150 mm, 200 mm
Silicon, SiC, Glass, Sapphire (LED)
Analog IC, Power IC, MEMS, R&D

Processes
  • RCA Clean
  • Photoresist Strip
  • Nitride Etch
  • Oxide Etch
Production Advantages
  • V3 uses the same subsystems as our highly reliable GAMA Series product line
  • Easy access serviceability
  • Upgradeable and reconfigurable as your needs change
  • Multiple chemistry support, processes/recipes and flexible configurations