Technical Articles

Maintaining a Stable Etch Selectivity between Silicon Nitride and Silicon Dioxide in a Hot Phosphoric Acid Bath

Maintaining a Stable Etch Selectivity between Silicon Nitride and Silicon Dioxide in a Hot Phosphoric Acid Bath

Experiments showed that increasing water concentration in the bath results in higher selectivity: more Si3N4 etched and less SiO2 etched ...
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How to Overcome the Effects of Silicon Build-Up During Solar Cell Wet Chemical Processing

How to Overcome the Effects of Silicon Build-Up During Solar Cell Wet Chemical Processing

Although the chemical reaction is well known, the anisotropic etching of Si in alkaline solutions is a complex process. This ...
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Optimized Wet Processes and PECVD for High-Efficiency Solar Cells

Optimized Wet Processes and PECVD for High-Efficiency Solar Cells

In this study, we highlight the effect of pre-cleans, texturization and final cleans on cell parameters. We also studied the ...
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CO2-Dissolved Water Cleans for 2xnm-Node Silicon Devices in a Single Wafer Megasonic System

CO2-Dissolved Water Cleans for 2xnm-Node Silicon Devices in a Single Wafer Megasonic System

Megasonic cleans have been applied to remove defects such as particles and polymer/resist residues in silicon wafer fabrication of IC ...
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Advanced Process Control of Chemical Concentration for Solar Cell Manufacturing

Advanced Process Control of Chemical Concentration for Solar Cell Manufacturing

The continuously increasing integration of today’s most advanced solar cells requires increasingly tight process control of the cell fabrication. Although ...
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Cost of Ownership Comparison of Single Wafer Processes for Stripping Copper Pillar Bump Photomasks

Cost of Ownership Comparison of Single Wafer Processes for Stripping Copper Pillar Bump Photomasks

A new generation of negative tone and chemically amplified positive tone photoresists by TOK, JSR, Dow Chemical and others has ...
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A New Approach to Tackle Wafer Contact Mark Contamination Issues in Marangoni Drying

A New Approach to Tackle Wafer Contact Mark Contamination Issues in Marangoni Drying

Contact mark contamination of Si wafers in Marangoni drying is related to water retention at the contact area between wafers ...
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Wet Chemical Processing with Megasonics Assist for the Removal of Bumping Process Photomasks

Wet Chemical Processing with Megasonics Assist for the Removal of Bumping Process Photomasks

A new generation of negative tone and chemically amplified positive tone photoresists by TOK, JSR, Dow Chemical and others has ...
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Correlation Between Conductivity and pH Measurements for KOH Texturing Solutions and Additives

Correlation Between Conductivity and pH Measurements for KOH Texturing Solutions and Additives

The ability to control the chemical concentration of etching baths is a critical step in being able to achieve uniform ...
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Process Control Challenges of Wet Etching Large MEMS Si Cavities

Process Control Challenges of Wet Etching Large MEMS Si Cavities

Anisotropic etching of silicon refers to the directional-dependent etching, usually by alkaline etchants like aqueous KOH, TMAH and other hydroxides ...
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Advanced Process Control of Chemical Concentration for Solar Cell Manufacturing

Advanced Process Control of Chemical Concentration for Solar Cell Manufacturing

Solar cell manufacturing requires many wet cleaning steps. Texturization is one of these steps. As a method for light trapping, ...
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Simultaneous Removal of Particles from Front and Back Sides by A Single Wafer Backside Megasonic System

Simultaneous Removal of Particles from Front and Back Sides by A Single Wafer Backside Megasonic System

In IC manufacturing, particle removal from a wafer's back side (BS) has become as important as that from the front ...
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