POLARIS G620 Physical Vapor Deposition System

System Overview
Polaris G620 is a fully automated general PVD sputtering system that supports a wide variety of applications and materials. It has a flexible chamber configuration around a single transfer module and can be configured with up to six modules.

 POLARIS G620 Physical Vapor Deposition System

POLARIS G620 Physical Vapor Deposition System

Substrate Size:
Technology Markets:
Process Modules:
Deposit Material:

150 mm, 200 mm; (100 mm with adapters)
IC, Power IC, MEMS, LED, and Advance Packaging
Up to 6 *
Cu, Ti, Ta, Al, AlSi, AlCu, Ni, NiV, Ag, Au, TiW, SiO2, Mo, Si, Ir, Hf, Pt
ITO, SiO2, TiO2, HfO2, Ta2O5, TaOx, TiN, TaN

*See the eVictor GX20 for higher capacity requirements

Processes
  • Metal films
  • Oxide films
  • Through silicon via deposition
Production Advantages
  • Excellent temperature and particle control
  • High target utilization rate and low operating costs
  • Optimized software algorithms and process recipes provide higher throughput and lower cost of operation
  • Flexible chamber configuration with up to six process modules, including Degas, Preclean and PVD
  • Manual or SMIF load lock ports