Plasma Etch for MEMS Technology
NAURA Akrion’s complete product line of plasma etch process tools for MEMS technology provides users with the ability to quickly and uniformly etch a wide variety of films to include silicon, dielectrics, metals, metal oxides, polymers, III-V & glass. Etch rates, selectivity and substrate temperature are optimized with the selection of the appropriate plasma source, reactant gases, switching speeds, temperatures control, and end point detection. Platforms are expandable from one to three process chambers to match the users capacity requirements.
Micro Electromechanical Systems (MEMS) are micro sensors or actuators that enable digital and analog microelectronics to interface with the outside world in a wide variety of applications. The most prevalent applications include smart devices, display technologies, gaming systems, fitness wearables, medical and scientific instruments, accelerometers for automobile airbags, tire sensor pressures and ink jet print heads.
GDE C200 is an ICP etch system for dielectric etch and compound semiconductors, designed with ultra-high density plasma sources for higher etch rates. Configuration options include: single, dual or triple process modules.
HSE 200 Plasma Etch System is designed specifically for deep silicon etching of MEMS and TSV applications. The dual zone RF source creates higher plasma density for higher etch rates. The platform can be configured with up to three process modules for R&D, pilot line, or mass production.