Plasma Etch for Digital IC Technology

NAURA Akrion’s complete product line of plasma etch process tools for Digital ICs, provides users with the ability to quickly and uniformly etch a wide variety of films to include silicon, dielectrics, metals, metal oxides, polymers, III-V & glass. Etch rates, selectivity and substrate temperature are optimized with the selection of the appropriate plasma source, reactant gases, switching speeds, temperatures control, and end point detection. Platforms are expandable from one to three process chambers to match the users capacity requirements.

The Digital IC (integrated circuit) market, largely composed of the largest IC manufacturers of memory, microprocessor, logic and foundry companies, is recognized as one of the most technically challenging markets in microelectronics. Modeled by the traditional “Moore’s Law”, Digital IC manufacturers are constantly pushing the limits in reducing feature size to new limits by introducing new device structures, novel materials and new methods.

NMC508C Silicon Etch System

The NMC508C is an ICP high-density plasma dry etching tool used for silicon etching of 200 mm wafers predominantly in Power and Logic ICs. It is a fully automated multi-chamber cluster tool capable of serial or parallel processing.

NMC508M Aluminum Metal Etch System

The NMC508M is an ICP high-density plasma dry etching tool used for aluminum and tungsten etching of 200 mm wafers predominantly in Power and Logic ICs. It is a fully automated multi-chamber cluster tool capable of serial or parallel processing.