Plasma Etch Equipment for Analog IC Technology
NAURA Akrion’s complete product line of plasma etch process tools for Analog IC technology, provides users with the ability to quickly and uniformly etch a wide variety of films to include silicon, dielectrics, metals, metal oxides, polymers, III-V & glass. Etch rates, selectivity and substrate temperature are optimized with the selection of the appropriate plasma source, reactant gases, switching speeds, temperatures control, and end point detection. Platforms are expandable from one to three process chambers to match the users capacity requirements.
Analog ICs (integrated circuits) condition and regulate “real world” functions such as temperature, speed, sound and electrical current. Unlike a digital IC that processes discrete levels of voltage (i.e., ON/OFF), Analog ICs process voltage/current that varies continuously (i.e., an analog signal). Analog ICs are used in a variety of applications such as operational amplifier (op-amp), comparator, clock/timer, analog-to-digital convertor (ADC), digital-to-analog convertor (DAC), sensor, and power management (usually referred to as Power ICs). While the feature sizes and line widths of Analog ICs are not as densely-packed as a typical Digital IC, the manufacturing challenges are no less demanding.
GDE C200 is an ICP etch system for dielectric etch and compound semiconductors, designed with ultra-high density plasma sources for higher etch rates. Configuration options include: single, dual or triple process modules.
The NMC508C is an ICP high-density plasma dry etching tool used for silicon etching of 200 mm wafers predominantly in Power and Logic ICs. It is a fully automated multi-chamber cluster tool capable of serial or parallel processing.