NAURA Akrion offers a full line of “offline” tools to support these essential functions. The GSE C200 can delayer a wide variety of layers on substrates/chips up to 8” diameter. The GAMA Clear IQ wet station cleans single or multiple chromium photomasks to ensure optimal light exposure. The Bpure Series of tube, boat and/or parts cleaners simplify the cleaning of vital components in the diffusion furnaces and etchers while keeps operators safe from hazardous chemistries and our series of ovens and stockers will dry those parts and keep them free from contamination.
Every microfabrication facility in the world needs equipment that may not necessarily “process” the wafer itself but still provides essential offline value. For example, process and yield enhancement teams need to delayer low yield wafers/devices to conduct a thorough failure analysis. Photolithography teams need to periodically clean photomasks. To keep process equipment running at the highest yields, the equipment engineering team conducts preventive maintenance and/or cleaning of their deposition, diffusion and plasma etch tools because contaminants build up and despite the best efforts at prolonging the mean time between cleaning with in-situ cleaning processes, eventually the tools need to be disassembled and certain parts that are prone to by-product deposition need to be hard-cleaned in an acid solution. Once the parts/components are cleaned, they need to be dried and stored in a contamination-free environment until they are needed for the next preventive maintenance cycle.
GSE C200 for Failure Analysis
The GSE C200 can delayer a wide variety of layers on substrates / chips up to 8” diameter. Process and yield enhancement teams need to delayer low yield wafers/devices to conduct a thorough failure analysis.
Bpure Tube & Boat Cleaner
Bpure Series of tube/boat cleaning tools provides customized cleaning (immersion or spray) of critical diffusion furnace components.
ClearIQ Mask Cleaning System
ClearIQ is a batch immersion reticle cleaning tool that removes organic contaminants, particles, and free ionic residues and haze. It uses a patented sulfuric megasonics technique that minimizes the degree of etching and roughening of the mask.