NMC508C Silicon Etch System

System Overview
The NMC508C is an ICP high-density plasma dry etching tool used for silicon etching of 200 mm wafers predominantly in Power and Logic ICs. It is a fully automated multi-chamber cluster tool capable of serial or parallel processing.

 NMC508C Silicon Etch System

NMC508C Silicon Etch System

Substrate Size:
Applications compounds:
Technology Markets:

200 mm
Silicon
Analog IC, Digital IC, Power IC

Processes
  • Shallow trench isolation (STI) etch
  • Polysilicon gate etch
  • Deep trench etch
  • Contact trench etch
  • Tungsten gate etch
  • Floating gate etch
  • Etch back
  • Zero mark etch
Production Advantages
  • Planar ICP with automatic matching and magnetic shield generates high plasma uniformity across the wafer
  • Independent control of center and edge gas injection optimizes etch rate uniformity
  • Symmetrical lining design provides better etch uniformity
  • Robust end point detection system maximizes signal-to-noise performance