Wet Batch Immersion for Power IC Technology

NAURA Akrion’s portfolio of batch wet immersion tools offer Power IC manufacturers the confidence that comes from years of experience in analog and digital IC production lines along with the flexibility of a modular platform of process technologies that meet your unique process needs no matter what material technology you choose. Our Power IC batch immersion equipment portfolio includes the customizable GAMA (fully automated) and the compact V3 (semi-automated) with unique tank designs, process recipes & in-situ process controls.

Power ICs control the conversion of electric power from one form to another. They are the intermediary between a SOURCE (generates power) and a LOAD (consumes power). Power ICs serve as either a switch (MOSFET, IGBT & BJT) or a rectifier (diodes & thyristors) and can be manufactured from a variety of materials to include silicon, silicon carbide or gallium nitride with several promising compound semiconductor materials in the future. Today, we all rely on Power ICs for everyday life essentials such as cellphones, tablets, and laptop chargers, portable battery packs, and hybrid vehicles. Applications are rapidly expanding in the energy (Photovoltaic, Grid, Wind), transportation (Rail, Automotive, Ships), and consumer markets. The increasing capabilities of Power ICs to handle higher voltages, currents and frequencies with reduced power loss is rapidly expanding adoption in multiple new fields.

 

GAMA Batch Immersion System

 Customizable, Fully Automated GAMA Batch Immersion for Power ICs

Customizable, Fully Automated GAMA Batch Immersion for Power ICs

The GAMA Series automated wet station is a flexible, modular system suitable for a wide variety of cleaning, etching and stripping applications for bare & reclaimed silicon wafers, IC devices, MEMS and photomasks.

V3 Compact Batch Immersion System

 Compact, Semi-Automated V3 for Batch Immersion of Power ICs

Compact, Semi-Automated V3 for Batch Immersion of Power ICs

V3 Compact Batch Immersion System offering either dry-to-dry or dry-to-wet processing with low exhaust requirements, few facility connections and easy maintenance access, while maintaining as much as a 20 percent footprint reduction over comparable tool sets. The V3 robot is designed to accommodate 150 mm or 200 mm wafers in standard cassettes for IC devices; alternate cassettes allow other materials to be processed using the standard robot arm. Suitable for R&D labs and applications.