Application: Remove damage created in the sawing process, texturize the wafer surface and prepare the wafers for diffusion.
The process uses base solution for particle removal and acids for controlled etching and texturization and for ionic contamination removal.
Create small bumps on the wafer to reduce the amount of light that is reflected off of the wafer surface.
Removal/Texturization click for full-size image
click for full-size image
For further information or to set up a teleconference with a NAURA Akrion process expert, please send an email request to email@example.com