Application: Remove damage created in the sawing process, texturize the wafer surface and prepare the wafers for diffusion.
The process uses alkaline solutions for particle removal and texturization and an acid solution for ionic contamination removal.
multiple tanks required for throughput
Removal/Texturization click for full-size image
click for full-size image
For further information or to set up a teleconference with a NAURA Akrion process expert, please send an email request to firstname.lastname@example.org