Monocrystalline Texturization

Monocrystalline Wafers

Application: Remove damage created in the sawing process, texturize the wafer surface and prepare the wafers for diffusion.

The process uses alkaline solutions for particle removal and texturization and an acid solution for ionic contamination removal.

Use an alkaline pre-treatment solution to remove organic contamination and particles from the wafer surface to improve texturization uniformity.
Heated KOH/IPA
multiple tanks required for throughput
Acidic solution eliminates damage (small cracks) from sawing process that if not eliminated would reduce the amount of energy that is outputted from the cell.
Final clean step removes metal impurities and oxide to maximize minority carrier lifetime and sheet resistance to yield higher cell efficiency.
Saw Damage
Removal/Texturization monocrystalline wafer cleaningclick for full-size image
Top View Drawing process station for multicrystalline wafers
click for full-size image
Additional Solar Applications:

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