Wet Processing Solutions
The GAMA Series automated wet station is a flexible, modular system suitable for a wide variety of cleaning, etching and stripping applications for bare & reclaimed silicon wafers, solar cells, IC devices, MEMS and photomasks.
Proven Platform
- Modular System Design/Build with High Reliability (>1500 Hours MTBF-SEMI E10-96)
- Small Footprint & Lowest Annual Consumable Parts Cost
- High Throughput & Low COO (Cost/Wafer)
- Common Platform: 150-300mm wafer sizes and Bridge Tool: IC’s, Solar Cells, Masks, Wafers & MEMS
- i-Clean in situ module reduces air interfaces, greatly reduces footprint
Platform Technologies Available
- ICE-1™: In-Line Concentration Control (DHF, SC1, SC2 & DIO3)
- i-Clean in situ Modules, Dual (Process & Rinse) Modules
- DIO3™ (Organic Removal & Surface Conversion)
- Combination Process Tools: Nitride Etch +Resist Strip & Resist +Ti Strip
- Tanks sized for optimal flow dynamics
Features
- SMIF, FOUP, Stocker & Overhead Transfer Options Available
- SEMI S2, SEMI S8, FM4910 and CE Safety Compliance
- Throughput and Facility Simulation/Modeling
- Class M1 Mini-environment Enclosure
- Turbo Phaser Megasonics
- Multiple Lot / Multiple Recipe Processing (> 5 recipes)
- High Selectivity Nitride Etch
- Robust AKS v6 Software on Windows 2000 Platform
Advanced FOUP Automation Features
- 25 wafer FOUP interface
- Auto calibration feature for carrier loading and auto notch finder
- Throughput: up to 250 wph (500 wph total); “Iron Man” field tested: 250,000 wafer transfers
- Face-to-face loading for AFEOL Clean
- Edge Grip Handling (no vacuum); separate handlers for “Dirty” and “Clean”
- Optional: FOUP stocker & Overhead Transfer (OHT)