Akrion Will Ship Multiple FEOL Clean Systems

Akrion Will Ship Multiple FEOL Clean Systems

Allentown, Pa., June 28, 2005 – Akrion, Inc. announced that it will supply several cleaning systems to a repeat customer in Taiwan. The tools will be used for FEOL cleaning in a 300mm production fab.

Akrion will ship 2 Goldfinger Mach2 single-wafer clean systems. The Taiwan customer’s system will utilize Goldfinger megasonics to remove sub 90nm particles from the front, back, and edge/bevel of the wafer simultaneously. Goldfinger megasonics are “tuned” for high particle removal efficiency without damage to sensitive device structures. Akrion’s Goldfinger Mach2/Mach2HP platform is available in configurations for both BEOL and FEOL cleaning applications.

Akrion will also supply a GAMA Series system that will include in situ technology for several process steps and their associated rinses in one module. This greatly reduces the system footprint.

The above systems, valued at $4.8 million will ship in the third quarter of this year.

About Akrion
Akrion is a leading provider of wet cleaning systems for the semiconductor industry. The company designs, manufactures, installs and services advanced batch-immersion and single-wafer wet cleaning equipment used in the production of a diverse range of semiconductor and related devices, including integrated circuits, micro-electrical mechanical systems (MEMS) and photomasks. Headquartered in Allentown, Pa., Akrion’s Allentown production facility is ISO 9001:2000 and ISO 14001:1996 certified. The company Web site is located at https://www.naura-akrion.com.