Allentown, Pa., January 9, 2006 – Akrion, Inc. announced today that it will ship 2 of its latest single wafer tool sets to a top tier semiconductor manufacturer in Korea.
The New Goldfinger Velocity platform provides the highest throughput in Akrion’s line, utilizing 4 FOUPS and 6 process chambers. The system uses the same efficient stacked chamber plan as the Goldfinger Mach2HP and Mach2MP tools, reducing the overall system footprint.
The Velocity platform is designed for full 300mm factory automation compliance. Configurations include new Goldfinger XP™ megasonics, and JetStream™ jet spray technology. Several other new technologies are used on Velocity including “fast swap” dual end effectors that allow dual wafer picks from SEMI standard FOUPs with swap times of less than 3 seconds.
James S. Molinaro, Akrion President and CEO commented, “The industry is rapidly moving toward single-wafer cleaning applications as the standard. Akrion is working diligently to stay ahead of the competition with technological enhancements that enable our customers to maximize their yields.”
Akrion is a leading provider of single-wafer and batch-immersion cleaning systems for the semiconductor industry. The company’s products are used in the production of a diverse range of semiconductor and related devices, including integrated circuits for DRAM, Flash, Logic and micro-electrical mechanical systems (MEMS) and photomasks. Headquartered in Allentown, Pa., Akrion’s Allentown production facility is ISO 9001:2000 and ISO 14001:2004 certified. The company Web site is located at https://www.naura-akrion.com.